on front Wafer curvature measurement with stress calculation |
|
| Batch size |
1 |
|---|
| Measurement unit |
MPa |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Tencor Flexus |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
aluminum ring |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
|---|
| Comments: |
|
