on front Wafer curvature measurement |
|
Batch size |
1 |
Measurement unit |
MPa |
Sides processed |
either |
Wafer size |
|
Equipment |
Tencor Flexus |
Equipment characteristics: |
Wafer holder Device that holds the wafers during processing. |
aluminum ring |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |