Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  AES (Auger-electron spectroscopy)
Process characteristics:
Materials
Material(s) to inspect.
Materials
Available  
Selected
Material(s) to inspect.
Thickness
Thickness of material(s) layer to inspect.
Thickness
Thickness of material(s) layer to inspect.
unconstrained
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment