Photoresist develop (NR1-6000PY) |
|
Batch sizes |
75 .. 200 mm: 4 |
Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
Futurrex RD6 |
Material |
NR1-6000PY |
Sides processed |
both |
Temperature |
25 °C |
Wafer size |
|
Equipment |
Develop bench |
Equipment characteristics: |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, gallium arsenide, glass (category), metal (category), sapphire, silicon, silicon on insulator |
Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |