Process Hierarchy

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  Contact sheet resistance measurement
Process characteristics:
Film thickness
Thickness of measured layer.
Film thickness
Thickness of measured layer.
unconstrained
Material
Material to measure sheet resistance on.
Material
Material to measure sheet resistance on.
Temperature
Specify preferred measurement temperature (if known).
Temperature
Specify preferred measurement temperature (if known).
unconstrained
Sides inspected
The sides of the wafer inspected by the process
either
Equipment