Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Buffered oxide etch
Process characteristics:
Depth
Depth to etch in material.
Depth
Depth to etch in material.
unconstrained
Material
Material to be etched.
Material
Material to be etched.
Minimum feature size (masked)
The dimension of the smallest masked feature to be protected during the etch.
Minimum feature size (masked)
The dimension of the smallest masked feature to be protected during the etch.
unconstrained
Minimum feature size (open)
The dimension of the smallest unmasked (open) feature to be etched.
Minimum feature size (open)
The dimension of the smallest unmasked (open) feature to be etched.
unconstrained
Etchant
Solutions and their concentrations.
 HF (buffered)
Sides processed both
Equipment