on front Spectroscopic ellipsometry film thickness measurement |
|
| Batch size |
1 |
|---|
| Refractive index |
1 .. 4 |
|---|
| Sides processed |
either |
|---|
| Thickness |
0.01 .. 5 µm |
|---|
| Wafer size |
|
|---|
| Equipment |
Gaertner Ellipsometer |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |
|---|
