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Film thickness measurement (ellipsometry): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Film thickness measurement (ellipsometry)
Process characteristics:
Film thickness
Expected film thickness.
Film thickness
Å
µm
nm
Expected film thickness.
unconstrained
Material
Film material to measure.
Material
alumina
aluminum oxide
BCB 3022-63
BCB 4024-40
BCB 4026-46
Borofloat (Schott)
borophosphosilicate glass
BSG
carbon
ceramic
Corning 1737
Durimide 115A
Durimide 7520
Foturan (Schott)
fused silica
gallium arsenide
gallium nitride
gallium phosphide
germanium
glass (Hoya)
glass (spin-on)
glass-ceramic
indium phosphide
kapton
lithium niobate
Magnesium fluoride
Magnesium oxide
other
phosphosilicate glass
phosphosilicate glass (low temperature)
polysilicon
Pyrex (Corning 7740)
PZT
quartz (single crystal)
sapphire
SF4 Glass
silicon
silicon carbide
silicon dioxide
silicon dioxide (low temperature)
silicon nitride
silicon oxy-nitride
soda lime
tantalum nitride
tantalum oxide
titanium oxide
white crown
white crown (zinc-borosilicate)
Zeonor
zinc oxide
zirconium dioxide
Film material to measure.
Batch size
1
Sides inspected
The sides of the wafer inspected by the process
either
Equipment