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4X E-beam XLS reticle mask: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
4X E-beam XLS reticle mask
Batch size
1
Critical dimension tolerance
0.1 µm
Defect density
Density (by area) of defects of a given size (e.g.,
[email protected]
).
[email protected]
(MI)
Magnification
4
Mask coating
Mask coating material (eg. chrome).
chromium
Mask material
quartz (fused silica)
Mask plate dimension
5x5x0.09"
Min feature size
1 µm
Equipment
Comments:
CD tolerance on <2um CD is 0.1um.
Price includes 90 min of
writing time. Excess writing
time will be charged at $15
per min, not to exceed 1X base price.