Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Flip-chip bonding
Process characteristics:
Ambient
Preferred bonding environment (if known).
Ambient
Available  
Selected
Preferred bonding environment (if known).
Bonding force
Preferred contact force applied when bonding materials (if known).
Bonding force
Preferred contact force applied when bonding materials (if known).
unconstrained
Curing temperature
Preferred curing temperature for underfilling material (if known).
Curing temperature
Preferred curing temperature for underfilling material (if known).
unconstrained
Encapsulation material
Specify preferred epoxy underfilling material (if known).
Encapsulation material
Specify preferred epoxy underfilling material (if known).
Min bond pad size
Minimum characteristic dimension of bond pad.
Min bond pad size
Minimum characteristic dimension of bond pad.
unconstrained
Min bond pad spacing
Minimum spacing between bond pads.
Min bond pad spacing
Minimum spacing between bond pads.
unconstrained
Temperature
Preferred bonding temperature (if known).
Temperature
Preferred bonding temperature (if known).
unconstrained
Equipment