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| Process characteristics: |
| 1st bonded material Material of die to be bonded. |
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| 2nd bonded material Material of substrate for die to be bonded to. |
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| Ambient Preferred adhesive curing environment (if known). |
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| Bond strength Required strength of die bond (if known). |
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| Encapsulation material Specify preferred epoxy die attach material (if known). |
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| Temperature Preferred curing temperature for die attach adhesive (if known). |
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| Equipment |
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