|
| Process characteristics: |
| Material |
|
|---|
| Depth |
1 .. 10 µm |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Min feature size |
2 µm |
|---|
| Sides processed |
both |
|---|
| Wafer size |
|
|---|
| Equipment |
Wetbench |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1500 µm |
|---|
