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| Process characteristics: |
| Blade thickness Thickness of cutting blade.
Bonded wafers require dicing with 300um blade.
25 um only for silicon wafers up to 550um thick |
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| Cuts per wafer Number of cuts per sample |
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| Diced wafer material |
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| Die separation (X-direction) The distance between cuts in X-direction. |
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| Die separation (Y-direction) The distance between cuts in Y-direction. |
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| Resist coat substrate Do you want resist on the exposed surface of the substrate before dicing? |
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| Ship wafer on dicing frame Select whether you would like the wafer to be shipped on the dicing frame or not. |
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| Batch size |
1 |
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| Wafer size |
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| Equipment |
Disco DAD 321 Automatic Dicer
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| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 10 cm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, irregular, circular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 2000 µm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, Pyrex (Corning 7740) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 2000 µm |
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| Comments: |
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