on front Optical surface profilometry |
|
| Batch size |
1 |
|---|
| Measurement aspect |
3D topology |
|---|
| Measurement unit |
nm |
|---|
| Sides processed |
either |
|---|
| Thickness |
0.001 .. 5000 µm |
|---|
| Wafer size |
|
|---|
| Equipment |
Zygo
|
| Equipment characteristics: |
| MOS clean |
no |
|---|
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 1000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), fused silica, glass (Hoya), Pyrex (Corning 7740), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
|---|
| Comments: |
|
