Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Wafer curvature measurement
Process characteristics:
Temperature
Specify preferred measurement temperature (if known).
Temperature
Specify preferred measurement temperature (if known).
unconstrained
Thickness
Thickness of substrate.
Thickness
Thickness of substrate.
unconstrained
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment