Spectrophotometric film thickness measurement |
|
| Process characteristics: |
| Material |
|
| Film thickness |
5 .. 5000 nm |
| Wafer size |
|
| Equipment |
Nanometrics NanoSpec 3000PHX |
| Equipment characteristics: |
| Batch sizes |
50 .. 150 mm: 1 |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
aluminum plate |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |