|
| Sides processed |
both |
|---|
| Temperature |
100 °C |
|---|
| Thermal duration |
30 s |
|---|
| Wafer size |
|
|---|
| Equipment |
Hotplate
|
| Equipment characteristics: |
| Batch sizes |
100 mm: 6, 150 mm: 4, 200 mm: 1, 75 mm: 6 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, gallium arsenide, glass (category), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |
|---|
