Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Supercritical dry
Process characteristics:
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Min feature size
Smallest feature in structure to be dried.
Min feature size
Smallest feature in structure to be dried.
unconstrained
Sides processed either
Equipment
Comments:
  • These processes are typically used to dry delicate free-standing MEMS structures. The basic idea is to remove the liquid used to etch and rinse the structure without subjecting the structures to capillary forces associated with evaporation of liquid. The rinsing liquid is replaced with another liquid, which is then frozen solid and sublimated (direct phase transition from solid to gas state) to avoid any liquid evaporation. These processes are very useful to avoid stiction in MEMS structures.