Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  PMMA resist sheet bonding
Alignment type
Method used to align materials to be bonded.
 unaligned
Wafer size
Wafer size
Equipment Wetbench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
 teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1500 µm
Comments:
  • Used to bond one or more PMMA
    sheets to substrate.
  • If substrate surface topology
    >250um solvent bonding is used.