|
| Pressure Pressure of process chamber during processing |
1 atm |
|---|
| Sides processed |
both |
|---|
| Temperature |
110 °C |
|---|
| Thermal duration |
15 min |
|---|
| Wafer size |
|
|---|
| Equipment |
Lindberg/Blue M mechanical oven |
| Equipment characteristics: |
| Batch sizes |
25 .. 150 mm: 24 |
|---|
| Wafer holder Device that holds the wafers during processing. |
quartz boat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
