on front Spectroscopic ellipsometry film thickness measurement |
|
| Batch size |
1 |
|---|
| Materials |
silicon dioxide, silicon nitride |
|---|
| Process duration |
15 min |
|---|
| Sides processed |
either |
|---|
| Thickness |
0.01 .. 5 µm |
|---|
| Wafer size |
|
|---|
| Equipment |
Gaertner Scientific Ellipsometer |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Comments: |
|
