Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Surface profilometry
Process characteristics:
Materials
Material(s) to profile on sample.
Materials
Available  
Selected
Material(s) to profile on sample.
Min feature size
Lateral dimension of the smallest feature to profile.
Min feature size
Lateral dimension of the smallest feature to profile.
unconstrained
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment