on front Optical Front-to-Front Alignment |
|
| Alignment side |
front |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
EVG 420 Aligner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 3000 µm |
|---|
| Comments: |
|
