Piranha clean II (non-MOS clean) |
|
| Batch size |
24 |
|---|
| Material concentrations |
sulfuric acid/hydrogen peroxide [98:2] |
|---|
| Process duration |
10 min |
|---|
| Setup time |
30 min |
|---|
| Sides processed |
both |
|---|
| Temperature |
120 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
VLSI sink 8 |
| Equipment characteristics: |
| MOS clean |
no |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon cassette |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
|---|
| Comments: |
|
