Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Line width measurement
Process characteristics:
Line width
Expected line width.
Line width
Expected line width.
unconstrained
Thickness
Thickness of layer in which line is formed (if known).
Thickness
Thickness of layer in which line is formed (if known).
unconstrained
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment