|
Ambient Ambient to which substrate is exposed during processing |
air |
Material |
AZ 5214 |
Sides processed |
both |
Temperature |
115 °C |
Thermal duration |
45 s |
Wafer size |
|
Equipment |
Thermal ace hotplate |
Equipment characteristics: |
Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
Wafer holder Device that holds the wafers during processing. |
stainless steel |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator |
Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 500 µm |