on front Optical surface profilometry |
|
| Batch size |
1 |
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| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
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| Min feature size |
1 µm |
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| Sides inspected The sides of the wafer inspected by the process |
either |
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| Vertical resolution Maximum vertical resolution of profiler. |
0.1 nm |
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| Wafer size |
|
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| Equipment |
Wyko Optical Profiler |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
0.1 .. 4 inch |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular, triangular shard, irregular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 20000 m |
|---|
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, alumina, Borofloat (Schott), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire, stainless steel |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 2000 µm |
|---|
