Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Film thickness measurement (interferometry)
Process characteristics:
Film thickness
Expected film thickness.
Film thickness
Expected film thickness.
unconstrained
Material
Film material to measure.
Material
Film material to measure.
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment