|
| Focal depth Depth of focus of a single objective at a single setting (include objective) |
0.8 µm |
|---|
| Magnification |
4 |
|---|
| Material |
Shipley UV210 |
|---|
| Max field size |
21 µm |
|---|
| Setup time |
30 min |
|---|
| Sides processed |
either |
|---|
| Wavelength Wavelength of light used during the exposure |
248 nm |
|---|
| Wafer size |
|
|---|
| Equipment |
ASML 5500/90 DUV 4X stepper |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 700 µm |
|---|
