Parylene C deposition: View

Process Hierarchy

Parylene C deposition

Process characteristics:

Thickness

Amount of material added to a wafer

1 .. 25 µm

Material

Parylene C

Pressure

Pressure of process chamber during processing

0.1 Torr

Sides processed

both

Temperature

24 °C

Wafer size

Equipment

Equipment characteristics:

Batch sizes

100 mm: 4, 50 mm: 6, 75 mm: 5

Wafer geometry

Types of wafers this equipment can accept

no-flat, 1-flat, 2-flat, notched

Wafer holder

Device that holds the wafers during processing.

flat chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, alumina, glass (category), metal (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire

Wafer thickness

List or range of wafer thicknesses the tool can accept

100 .. 10000 µm

Comments:

Parylene C is an inert, hydrophobic, optically clear biocompatible polymer coating material used in a wide variety of industries. Because it is deposited by vapor deposition, Parylene provides a conformal coating on virtually any substrate which is not achievable by other means. Its lubricity is close to that of Teflon but can be applied uniformly in much thinner coatings, ideal for MEMS and BioMEMS based applications. Parylene's pinhole free conformal coating protects coated substrates from moisture, chemicals, and electric charge. While Parylene is typically used to coat circuit boards or immobilize particles, it can also be removed from the original surface and used as a microstamp allowing MEMS patterns to be transferred reproducibly to polymers with various properties.
Parylene properties are available from the manufacturer at
www.scscookson.com/parylene_knowledge/index.cfm
In single-sided depositions, another set of dummy wafers must be provided to cover the backside of the wafers.