on front Microscope inspection |
|
| Batch size |
1 |
|---|
| Magnifications |
5, 10, 20, 50, 100 |
|---|
| Process duration |
30 min |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Olympus microscope |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
recessed platen |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, gallium arsenide, silicon on sapphire, sapphire, glass (category), quartz (single crystal) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 10000 µm |
|---|
