Photoresist Descum (Ion 40) |
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| Depth |
1 .. 1000 Å |
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| Gas |
Oxygen |
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| Material |
photoresist (category) |
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| Wafer size |
|
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| Equipment |
Metroline / IPC Plasma Photoresist Stripper |
| Equipment characteristics: |
| Batch sizes |
100 mm: 3, 150 mm: 3, 200 mm: 1, 50 mm: 3, 75 mm: 3 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
aluminum plate |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 700 µm |
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