Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Soft bake
Batch size 25
Process duration 25 min
Sides processed both
Temperature 90 °C
Thermal duration 25 min
Wafer size
Wafer size
Equipment Prebake oven
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, quartz (single crystal), glass (category), sapphire, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 1000 µm
Comments:
  • Other wafer sizes can be accommodated, but wafers will be placed flat on a piece of foil (not loaded in a cassette).