on front Contact front-back alignment |
|
| Alignment side |
back |
|---|
| Alignment tolerance Registration of CAD data to features on wafer |
2 µm |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Min feature size |
1 µm |
|---|
| Setup time |
60 min |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Karl Suss MA6 Mask Aligner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |
|---|
| Comments: |
|
