on front Isotropic plasma etch |
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| Process characteristics: |
| Depth Depth to etch in material.
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| Etching source gases Specify preferred source gases for the etch process (if known).
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| Material Material to be etched. |
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| Minimum feature size (masked) The dimension of the smallest masked feature to be protected during the etch.
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| Minimum feature size (open) The dimension of the smallest unmasked (open) feature to be etched. |
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| Sides processed |
either |
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| Equipment |
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