on front Wafer curvature measurement with stress calculation |
|
| Batch size |
1 |
|---|
| Sides processed |
either |
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| Wafer size |
|
|---|
| Equipment |
Flexus 2-300 |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 800 µm |
|---|
| Comments: |
|
