Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Wafer dicing
Process characteristics:
Blade thickness
Preferred thickness of dicing blade (if known).
Blade thickness
Preferred thickness of dicing blade (if known).
unconstrained
Die separation (X-direction)
Length of die including dicing streets.
Die separation (X-direction)
Length of die including dicing streets.
unconstrained
Die separation (Y-direction)
Width of die including dicing streets.
Die separation (Y-direction)
Width of die including dicing streets.
unconstrained
Resist coat substrate
Protect the front of the substrate with photoresist during dicing.
Resist coat substrate
Protect the front of the substrate with photoresist during dicing.
Equipment