on front Microscope inspection |
|
| Batch size |
1 |
|---|
| Magnifications |
5, 10, 20, 50, 100 |
|---|
| Sides inspected The sides of the wafer inspected by the process |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Leitz Ergolux |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
glass plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 5000 µm |
|---|
| Comments: |
|
