on front Stylus profilometer step measurement |
|
| Batch size |
1 |
|---|
| Min feature size |
2 µm |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Tencor P-1 Contact Profiler |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, alumina, Borofloat (Schott), Pyrex (Corning 7740), quartz (single crystal), sapphire |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
|---|
