Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact I-line photolithography (Shipley 1818 - MJB3)
  1 Prebake II
  2 HMDS Prime
MaterialHMDS
on front
  3 Photoresist coat (Shipley 1818)
MaterialShipley 1818
  4 Softbake I
MaterialShipley 1818
on front
  5 Contact front-front alignment (MJB3)
on front
  6 I-line exposure (MJB3)
Materialphotoresist (category)
  7 Photoresist develop (Shipley 1818)
MaterialShipley 1818
  8 Hardbake I
Materialphotoresist (category)
Process characteristics:
Alignment side
Alignment side*
Perform hard bake
Perform hard bake*
yes no
Perform prime
Perform prime*
yes no
Perform slow bake
Perform slow bake*
yes no
Resist thickness
Resist thickness
must be 1 .. 2 µm
1 .. 2 µm
Batch size 4
Magnification 1
Material Shipley 1818
Sides processed either
Wafer size
Wafer size
Comments: