Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat (Shipley 3612)
  1 Dehydration bake
on front
  2 100% HMDS prime
MaterialHMDS
on front
  3 Photoresist coat (Shipley 3612)
MaterialShipley 3612
  4 Soft bake
  5 Hard bake
Process characteristics:
Resist thickness
Thickness of material to be deposited.
Resist thickness*
Thickness of material to be deposited.
Material Shipley 3612
Wafer size
Wafer size
Comments:
  • The film is hardbaked at 110 C for 25 min.