Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat with softbake (AZ 9260)
  1 HMDS Prime
MaterialHMDSThickness1 nm
on front
  2 Photoresist coat (AZ 9260)
MaterialAZ 9260
  3 Photoresist softbake (AZ 9260)
MaterialAZ 9260
Process characteristics:
Resist thickness
Resist thickness*
must be 6 .. 10 µm
6 .. 10 µm
Excluded materials gold (category), copper
Material AZ 9260
Wafer size
Wafer size
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.