|
| Cleaning agents |
NH3OH+H2O2, DI, HCl+H2O2, DI, HF, DI |
|---|
| Sides processed |
both |
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| Temperature |
75 °C |
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| Wafer size |
|
|---|
| Equipment |
Wet etch bench |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
teflon boat, teflon carrier |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), Pyrex (Corning 7740), silicon on insulator, silicon, ceramic |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
