Glass frit printing/firing |
|
| Alignment tolerance Registration of CAD data to features on wafer |
10 µm |
|---|
| Min feature size |
150 µm |
|---|
| Second substrate diameter |
100 mm |
|---|
| Second substrate material |
Pyrex (Corning 7740) |
|---|
| Second substrate thickness |
300 .. 1000 µm |
|---|
| Temperature |
400 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
screen printer |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1 |
|---|
| MOS clean |
no |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
|---|
