on front AFM (Atomic force microscopy) |
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| Process characteristics: |
| Materials Material(s) to inspect. |
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| Measurements per wafer |
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| Sides inspected The sides of the wafer inspected by the process |
either |
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| Wafer size |
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| Equipment |
Digital instruments AFM
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| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1 |
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| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 200 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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| Comments: |
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