Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Resist bonding
Batch size 1
Material Arch OiR 897-10i
Sides processed either
Thickness 1 .. 2 µm
Wafer size
Wafer size
Equipment spindryer3
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 600 µm