|
| Duration |
20 min |
|---|
| Materials |
BCB 4024-40, BCB 3022-63, BCB 4026-46 |
|---|
| Sides processed |
both |
|---|
| Temperature |
125 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Fisher oven |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 125 mm: 25, 150 mm: 25 |
|---|
| MOS clean |
no |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
|---|
