|
| Process characteristics: |
| Process duration |
|
|---|
| Temperature |
|
|---|
| Anneal ambient |
air |
|---|
| Batch size |
3 |
|---|
| Wafer size |
|
|---|
| Equipment |
Blue M Bake Oven |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
