Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Wafer Coring
Process characteristics:
Blade thickness
Preferred thickness of dicing blade (if known).
Blade thickness
Preferred thickness of dicing blade (if known).
unconstrained
Diameter
Diameter of new substrate(s).
Diameter*
Diameter of new substrate(s).
unconstrained
Resist coat substrate
Protect the front of the substrate with photoresist during dicing.
Resist coat substrate
Protect the front of the substrate with photoresist during dicing.
Equipment