|
| Process characteristics: |
| Depth |
|
|---|
| Batch sizes |
100 mm: 25, 150 mm: 1 |
|---|
| Etch type |
wet isotropic |
|---|
| Etchant Solutions and their concentrations. |
potasium iodide/ iodine |
|---|
| Material |
gold |
|---|
| Sides processed |
both |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Wet Bench (acid) |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
0 .. 100 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
300 .. 800 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |
|---|
